Engineered High Performance Encapsulants

The ENTEX series was developed to cover a wide range of potting and encapsulating products to meet high performance requirements in aerospace and electronic applications. Our systems protect your assemblies from the degrading environmental and operating effects of chemical exposure, moisture, thermal cycle and shock, current leakage and vibration. We are the technology leader in heat transfer, thermally conductive potting systems. Our high purity encapsulants are self-leveling, void-free systems that offer unprecedented performance in today's smaller, thinner, lighter packages. These high-performance characteristics are also available in custom products, which can be designed to meet your specific requirements.

Benefits of the ENTEX line include...

• Excellent dimensional stability
• Self Leveling
• Exceptional dielectric properties
• Heat transfer capabilities
• High performance on heat sensitive components
• Low exotherm
• Low shrinkage
• Low temperature curing, resulting in less stress on the cured product
• Wide operating temperature range

For more information about the ENTEX line of potting and encapsulating resins, contact Resin Designs.